COPPER POST technology helps Apple’s dream of building a slim folding iPhone

With a thickness of 1.5mm, the iPhone 6 Air will be the thinnest Apple device in the smartphone category. While this feature may be attractive to those who prefer aesthetics to anything else, the fact is that this design has a heavy price, such as using a very small battery. Also, a chassis of this thickness will certainly cause thermal problems, meaning that the A19 Pro processor, which is said to provide power, will not work with all its potential.

The new report shows that the iPhone 6 will use technology called Copper Post, allowing the processor to work with higher performance, even though Apple has reduced its future flagship thickness.

COPPER POST technology is a semiconductor subsoner that will be used for the first time on the iPhone 5 Air. This technology enables parts that are up to 5 % smaller. Although Apple’s Awe Inspiring is close, we don’t know much about future devices. Fortunately, the Jungang report shows that the technology giant plans to solve the thermal concern of the iPhone 5 using technology called Copper Post. The technology is developed by LG Innotek and will be used commercially for the first time in the flagship and slim. Typically, the logical board and semi -resonant underlying are connected to each other using soldering balls.

With Copper Post technology, the LG Innotek method sets up copper bases and places semicircular solder balls on top of them that helps reduce levels and size. This will help mass production of semiconductor underlines, which are up to 5 % smaller. This technology gives Apple the necessary freedom to reduce the thickness of models such as the iPhone 5 Air without endangering performance. The interesting thing is that the Copper Post technology was first used in the “Communication Chip” of the iPhone 16E earlier this year and is now opening its way to the iPhone 6.

The same semi -resana sublime mining technology may also be used next year on the folding iPhone, as it has two parts that need to be folded. The use of Copper Post technology allows next year’s flagship phone to be released in a thinner form, while also designed to effectively relieve heat. Now, we have to see if this change is a better alternative than the steam compartment used in the iPhone 5 Pro and the IPhone 4 Pro Max.