Iel unveiled its significa improvemes in the packaging of its next-generation chips
Iel is working hard to overcome the limitations imposed by Moore’s Law, and in this regard, it has reported significa progress in creating glass substrates for advanced packaging in its next-generation technology.
According to Hoshio, the major chip maker said this remarkable achieveme is set to change the limits of making tiny transistors and help data-driven applications and the advanceme of Moore’s Law. The company predicts that the number of transistors in computer chips will double every two years. Iel has also announced that it plans to use glass layers in its chips by the end of 2020. The company made the announceme ahead of its Iel Innovation 2023 conference in San Jose, California this week.
Chip technology has advanced twice as much in the past six decades thanks to this effect. In 1971, the first Iel microprocessor had 2,300 transistors. Now the flagship chips of this company have more than 100 billion transistors. However, most of this growth was achieved by reducing the space between on-chip circuits. But unfortunately, that progress is now slowing down because chip layers are now so small that they are at the atomic level.
So in a surprising move, Iel has discovered a new approach to keeping chip technology in line with Moore’s Law. Instead of shrinking chip packages, they are now focusing on creating larger chip packages, which they believe will lead to further improvemes.
The use of glass enables Iel to create a 50% larger chip space in a package to accommodate more chips in an electrical package.
“Iel predicts that by the end of the decade, 30 trillion transistors will be packaged on a glass substrate with other innovations such as 3D layouts,” said Rahul Manpali, an Iel member and director of substrate module engineering, at a press conference.
“We use our glass core underlayer technology, which increases feature scaling and enables smaller, more advanced compones on computer chips,” he said. This allows us to do things that an organic package cannot do. This allows us to improve the power delivery to these AI-based and data-driven chips. This enables us to perform high-speed I/O signals that are not possible in organic packages. Losses need a signal.
This also enables high production efficiency and low costs, Manpali said. Glass substrates will be another option for faster and better bonding, along with other advancemes such as 3D packaging.
History of chip packaging
From the 1970s to the 1990s, early microprocessors used lead wireframe packages. Then the industry turned to ceramic pins for packages. Then came the grid-ball arrays with a flip organic (BGA) chip. Lead-free and halogen-free packaging solutions were iroduced in the early 2000s. Now Iel is trying to pack more chips io a package, but there are limits to organic packaging technology.
Now chip packages are getting bigger and bigger, and artificial ielligence is increasing the demand for more performance.
He said: “We are at an inflection poi and we see that the use of glass core substrates greatly increases the electrical and mechanical properties. “We have shown through some of our iernal studies that the density achieved in a glass core can be up to 10 times or more compared to an organic core.”
Iel has been making a lot of tweaks recely to improve the connections between its computer chips. They achieve this by putting multiple chips together in an electronic package. According to Manepali, Iel has been using its multi-connectivity technology since 2017 to achieve this goal.
The company is changing the spacing between the molds used in its factories. They make the space between the molds smaller, from 55 microns to 45 microns and 36 microns. Iel has also been using their 2.5D technology since 2019, which enables them to stack chips using a 3D stacking technology called Foveros.
